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Annealing Equipment Product List and Ranking from 9 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

Annealing Equipment Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. ウシオ電機 Tokyo//Industrial Electrical Equipment
  2. マツボー Tokyo//Trading company/Wholesale
  3. 神港精機 東京支店 Tokyo//Industrial Machinery
  4. 4 ジェイテクトサーモシステム Nara//Electronic Components and Semiconductors
  5. 5 西野製作所 Ishikawa//Manufacturing and processing contract
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Annealing Equipment Product ranking

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. Third light heating source! LED annealing device ウシオ電機
  2. Flash Lamp Annealing Device "SUS980 Series" ウシオ電機
  3. Flash Lamp Annealing Device FLA マツボー
  4. 4 Annealing device "Variable Atmosphere Heat Treatment Device" 神港精機 東京支店
  5. 4 Contact annealing lamp annealing device "RLA-3100-V" ジェイテクトサーモシステム

Annealing Equipment Product List

1～15 item / All 16 items

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Annealing device "Variable Atmosphere Heat Treatment Device"

Annealing device "Variable Atmosphere Heat Treatment Device"

Capable of processing various substrates such as wafers and glass; a variable atmosphere heat treatment device compatible with a wide range of applications (supports sample testing in O2 or H2 atmosphere annealing).

We offer a rapid temperature rise and fall type "horizontal annealing device" that can be processed in vacuum, oxygen atmosphere (at atmospheric pressure), and reducing atmosphere (at atmospheric pressure). It is capable of processing various substrates (wafers, ceramics, glass, mounted substrates) up to 6 inches, and has a proven track record in applications such as annealing of thin films and wafers, firing of nano metal pastes, and curing of organic materials. For those who wish to evaluate our equipment, we offer sample testing. Please contact us for details on specifications and available test contents. 【Features】 ■ Uniform heating treatment in various atmospheres (vacuum, N2, O2, H2) (up to 900°C) ■ Rapid cooling through the movement of the heating furnace body ■ Processing in a clean atmosphere using quartz tubes ■ Wide range of application support *For more details, please feel free to contact us.

  • Other physicochemical equipment
  • Heating device

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Electrode film annealing device for compound semiconductors (variable atmosphere heat treatment device)

Electrode film annealing device for compound semiconductors (variable atmosphere heat treatment device)

A quartz tube type annealing device commonly used for alloying and reducing resistance of electrode films in compound semiconductors. It is a high-temperature processing type equipped with a rapid cooling mechanism. It is also compatible with transparent electrode films.

Customizing an annealing device with extensive experience in Si processes for compound semiconductor processes. Capable of high temperatures (900-1000°C) compared to hot plate types for GaAs. Proven results in the alloying of electrodes for nitride semiconductor films. Equipped with a rapid temperature rise and fall heating furnace to control the annealing of electrode films with uniform heating and optimal temperature profiles. A heat treatment device for wafer processes with a proven track record that can propose optimal equipment configurations based on production volume and processes.

  • Annealing furnace
  • Heating device

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Third light heating source! LED annealing device

Third light heating source! LED annealing device

Improved heating efficiency for energy savings! Achieving reduced thermal budget with high responsiveness.

The "LED Annealing Device" is the third light heating source following halogen heaters and flash lamps. It achieves energy savings through improved heating efficiency and reduces thermal budget with high-speed responsiveness. Real-time temperature measurement using a radiation thermometer is possible. Additionally, it can heat the surface of substrates and demonstrates excellent heating efficiency for metal materials. 【Features】 ■ Improved heating efficiency ■ High-speed responsiveness ■ High-precision temperature measurement ■ High uniformity ■ Capable of heating substrate surfaces *For more details, please refer to the PDF materials or feel free to contact us.

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  • Heating device

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◆ANNEAL◆ Wafer Annealing Equipment

◆ANNEAL◆ Wafer Annealing Equipment

Max 1000℃, maximum 3 systems for MFC, APC pressure control, compatible with 4" or 6" substrates, high vacuum annealing equipment (<5 × 10^-7 mbar)

High-temperature processing up to 1000°C is possible with a heating stage installed in a high vacuum water-cooled SUS chamber. A heat shield is installed inside the chamber to ensure safety through interlock. The mass flow controller can be expanded to a maximum of three systems, allowing for firing operations at precisely adjusted process gas pressures (with the APC automatic process control system option). Additionally, there are many options available, including a front viewport, dry scroll pump, special substrate holder, and additional thermocouples. The heating stage inside the chamber has three variations depending on the process gas atmosphere and treatment temperature. - Halogen lamp heater: Max 500°C - C/C composite heater: Max 1000°C (only in vacuum or inert gas) - SiC coating heater: Max 1000°C (in vacuum, inert gas, O2)

  • Annealing furnace

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Various film formation and annealing equipment

Various film formation and annealing equipment

A lineup tailored to your needs! Film deposition equipment and annealing equipment using lamp heating.

At Omura Giken, we design and manufacture film deposition equipment and annealing devices using lamp heating to meet our customers' needs. We offer a lineup that includes vertical LP-CVD devices, vertical annealing devices, PE-CVD devices, and MO-CVD devices. 【Features】 ■ Custom design and manufacturing to meet needs ■ Film deposition equipment and lamp heating annealing devices ■ Diverse lineup *For more details, please refer to the PDF materials or feel free to contact us.

  • Annealing furnace
  • Other semiconductor manufacturing equipment

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Vertical vacuum annealing device

Vertical vacuum annealing device

Wafer process-compatible full-scale production system for annealing, sintering, and polyimide curing, supporting high throughput with mini-batch and rapid cooling mechanism.

Uniform heating in a clean vacuum. Ideal for processes requiring high cleanliness and low oxygen concentration. Vertical quartz tube annealing device. Compatible with wafers up to 8 inches and various substrates. Automation and clean system achieved through the use of a CtO-C system. Stable temperature distribution performance from medium to high temperatures, with a rapid processing mechanism for short cycle times. A multifunctional heat treatment device capable of processing not only in vacuum but also in various atmospheres (inert, oxidation, reduction).

  • Annealing furnace

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Flash Lamp Annealing Device FLA

Flash Lamp Annealing Device FLA

Various materials such as semiconductors! Annealing is possible in ultra-short times ranging from a few milliseconds to several hundred milliseconds.

The Flash Lamp Annealing device, FLA, is a standalone unit designed for DTF-FLA ultra-short time annealing. It is capable of ultra-short annealing times ranging from a few milliseconds to several hundred milliseconds for semiconductor materials and other materials. The very short pulses (micro/millisecond level) from the xenon flash lamp heat only the surface at an ultra-fast heating rate, making it a compact research and development device suitable for applications such as annealing films on flexible substrates and substrates with low heat resistance. It is compact, user-friendly, and ideal for research and development in various applications. For more details, please contact us or refer to the catalog.

  • Annealing furnace

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Contact annealing lamp annealing device "RLA-3100-V"

Contact annealing lamp annealing device "RLA-3100-V"

Processing of GaN substrates is also possible! Introduction of contact annealing lamp annealing (RTP) equipment.

The "RLA-3100-V" is a contact annealing lamp annealing (RTP) device that can accommodate a wide range of wafer sizes up to 6 inches. It features a vacuum-designed quartz tube that allows for a clean vacuum (LP) environment and processing in an N2 load lock atmosphere. Additionally, it is equipped with an automatic wafer exchange mechanism, enabling C to C transport. 【Features】 ■ Supports a wide range of wafer sizes up to 6 inches ■ Equipped with an automatic wafer exchange mechanism for C to C transport ■ Improved annealing characteristics due to vacuum compatibility ■ Achieves short TAT with N2 load lock compatibility ■ Capable of processing GaN substrates *For more details, please refer to the PDF document or feel free to contact us.

  • Other semiconductor manufacturing equipment

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Flash Lamp Annealing Device "SUS980 Series"

Flash Lamp Annealing Device "SUS980 Series"

Depending on the work size, multiple flash lamps can be arranged! Large area simultaneous irradiation and high-intensity irradiation are possible!

The "SUS980 Series" is a flash lamp annealing device that can be used for applications such as crystallization, peeling, and oxide film formation. By controlling the current flowing through the lamp with a semiconductor switch to turn it ON/OFF, the pulse width of the lamp current can be adjusted, allowing for control of the heating depth (0.1 to 60 msec). Depending on the work size, multiple flash lamps can be arranged for large area irradiation, enabling high irradiation. 【Features】 ■ Depth control (pulse control) ■ ON/OFF control of the current flowing through the lamp using a semiconductor switch ■ Adjustable lamp current pulse width for controlling heating depth (0.1 to 60 msec) ■ Multiple pulse irradiation is also possible ■ High output and large area processing (shortened tact time, high uniformity) *For more details, please refer to the PDF document or feel free to contact us.

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  • Heating device

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Vacuum Process Gas High-Speed Annealing Equipment "RTP/VPO Series"

Vacuum Process Gas High-Speed Annealing Equipment "RTP/VPO Series"

Maximum reaching temperature of 1,000℃! This is a high-speed annealing heating device that can be integrated into inline systems as well as for prototype development purposes.

The "RTP/VPO series" is a tabletop type high-speed annealing device for vacuum and process gases. It includes models such as "RTP-150," which is suitable for research and development requiring high purity and stability, such as the thermal oxidation process of SiC and crystal growth of GaN, as well as "RTP-100" and "VPO-1000-300." 【RTP-150 Features】 ■ Compatible with 6-inch wafers ■ Maximum achievable temperature of 1000℃ ■ Achieves linear temperature control ■ Significantly reduces the occurrence of contamination ■ Options available to accommodate various experimental environments *For more details, please refer to the PDF document or feel free to contact us.

  • Other mounting machines

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High Vacuum Annealing Device "SAF-52T-II"

High Vacuum Annealing Device "SAF-52T-II"

You can achieve improved production efficiency and reduced cycle time.

The high vacuum annealing device "SAF-52T-II" is developed for the purpose of removing internal stress distortions that occur during the processing of quartz oscillators and for thermal treatment to stabilize electrode films. It features a heating shelf measuring W460×D350×H35mm with a total of 10 independent processing chambers, capable of holding up to 60 standard trays measuring 170×134mm. 【Features】 ○ Equipped with two independently operable processing chambers ○ Enhances production efficiency and reduces cycle time ○ Efficient cycle time and labor-saving through full automation For more details, please contact us or download the catalog.

  • Annealing furnace

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Horizontal hydrogen annealing device (variable atmosphere heat treatment device)

Horizontal hydrogen annealing device (variable atmosphere heat treatment device)

Supports small-diameter wafers (4 inches) and niche processes for compound semiconductors. Compatible with both crystal processes and wafer processes (alloying and electrode annealing).

A dedicated annealing device designed for special applications such as epitaxial layers of compound semiconductors and the annealing of polished Si wafers. After high vacuum evacuation, the atmosphere is replaced with hydrogen up to atmospheric pressure, allowing for uniform heating at high temperatures (1000°C) in a high-purity reducing atmosphere.

  • Annealing furnace
  • Electric furnace
  • Other surface treatment equipment

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Hydrogen annealing device (for electronic devices, currently supporting sample testing)

Hydrogen annealing device (for electronic devices, currently supporting sample testing)

Uniform heating in atmospheric pressure hydrogen atmosphere. Providing flexible hard support and sample testing with abundant experience and track record for thin films, wafers, compound, and ceramic substrates.

Maximizing the reducing power of hydrogen to achieve high-quality thin films and substrate surfaces that are unprecedented. Ideal for thermal processing (bake and anneal) of delicate compound devices and dielectric substrates. High reliability supported by proven results and experience ensures safety. Responding from the initial stage, including testing, based on extensive achievements in enhancing the quality of electrodes and wiring films, controlling the resistance and stress of high melting point metal films, and end processing of polished wafers for special applications.

  • Annealing furnace
  • Oxidation/Diffusion Device
  • Heating device

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